Simulation and Designs for Optical Coupling in PICs & Co-packaged Optics - Seguridad Mania.com - España y América Latina

As optical systems become increasingly integrated, chip-to-chip and chip-to-fiber optical coupling have emerged as critical design challenges for photonic integrated circuits and co-packaged optics.

 

Join senior application engineers Yi-Hao Chen and Angel Morales, and guest MIT speaker, Drew Michael Weninger in our upcoming webinar for an in-depth presentation on optical coupling simulation methodologies, packaging design challenges, and the advantages and disadvantages of different techniques such as evanescent couplers, gratings, free form or edge couplers.

 

This webinar will introduce multi-scale simulation workflows using Lumerical FDTD, MODE, and Zemax OpticSudio to design a chip-to-fiber coupler with a large alignment tolerance. Learn how to use suitable solvers for establishing design constraints and optimizing taper geometry, alignment tolerances, wavelength and polarization response, and fabrication tolerances for high-volume manufacturing of chip-to-chip optical couplers.